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Automotive Electronics

News articles relevant for automotive content, whether in terms of components, power, communications, infotainment or testing.

UK GaN transistor maker leads European power module consortium

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Cambridge GaN Devices (CGD) is to lead a €10.3m project to develop intelligent GaN power modules. Called GaNext, and part of the Penta programme, its partners include academic and commercial organisations from the UK, German and The Netherlands – Infineon is one of the partners (list below) The modules are intended to address gate drive and EMI issues associated with fast-switching ...

Auto segment to show strongest semi market CAGR

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The automotive IC segment is expected to show the biggest CAGR 2019-24 of all the IC segments at 9.7%, says IC Insights. Even so, auto will still represent under 10% of the total chip market in 2024. Over the past 21 years, the communications IC segment almost doubled its share of the total IC market from 18.5% in 1998 to ...

Rohm’s 4th gen 1.2kV SiC mosfets

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Rohm has announced a 4th generation of 1.2kV silicon carbide mosfets, honing them for driving the traction motors of electric vehicles as well as industrial equipment power supplies. “For power semiconductors, there is often a trade-off between lower on-resistance and short-circuit withstand time,” said the company. “Rohm was able to improve this relationship and reduce on-resistance per unit area by ...

2kV 20kW tester for electric vehicles

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Keysight has added a 2kV ±30A 20kW model to its RP7900 series of instruments for battery and electronics testing in hybrid and electric vehicles. Called RP7973A, it is desigend to run from 400V or 480V three-phase and is capable of two quadrant operation – if can feed power back into the mains. “The regenerative design enables the energy normally consumed to ...

To improve self-driving algorithms, add the concept of empty space

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Teaching self-driving artificial intelligence about the empty space around it could improve the recognition of surrounding objects, according to researchers at Carnegie Mellon University – combining the merit of classic mapping and deep learning for 3D object detection. According to the university, when tested against a standard benchmark, the new method outperformed the previous top-performing technique – improving detection by ...

NXP chooses TSMC for 5nm auto ICs

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NXP is to use TSMC’s 5nm technology for its automotive chips. The 5nm SoC portfolio will address connected cockpits, high-performance domain controllers, autonomous driving, advanced networking, hybrid propulsion control and integrated chassis management. NXP will adopt N5P, an enhanced version of TSMC’s 5nm technology, which provides about 20% faster speed or about 40% power reduction compared to 7nm. NXP’s developments ...

Million mile EV battery

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Amperex, the Chinese lithium-ion car battery maker, says it has developed a car battery that will last for two million kilometers, last 16 years and cost only 10% more than current batteries. Current EV batteries carry a 150,000 mile, eight year warranty. The new battery could bring down the cost of EV ownership by allowing a car owner to use ...

Rohm teams with automotive parts maker for SiC electric vehicle drives

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Rohm has signed a deal to develop silicon carbide electric vehicle drives with Vitesco Technologies. “Energy efficiency is of paramount importance in an electric vehicle,” said Vitesco v-p Thomas Stierle. “As the traction battery is the only source of energy in the vehicle, any losses caused by power conversion need to be minimised. We are therefore developing a SiC option within ...

Bridge chips sort automotive display bus incompatibilities

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Toshiba is addressing incompatible automotive display interfaces with a pair of bridge ICs. “The number of display panels incorporated into modern vehicles has increased significantly, with infotainment systems often including several different display interface types,” according to the company. “Consequently, some current systems cannot support emerging protocols such as DSI {display serial interface] and eDP [embedded DisplayPort].” The bridge chips ...

Winbond adds sequential read to QSPI NAND flash

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Winbond has added sequential read to QSPI NAND flash memories, startign with its W25NxxxJW. “In sequential read mode, the products achieve the same 52Mbyte/s maximum data rate at 104MHz as in continuous read mode, but with new flexibility to configure the chip’s operation,” according to the company. Key options are now: Error correction: While in continuous read, Winbond W25N devices only ...