Automotive Electronics

The sheer volume of automotive electronics in today’s cars is dramatically driving up the transmission requirements and data payload on automotive networks, writes Lukas Droemer of Nexperia. To take the next step we need high-speed, high-bandwidth Automotive Ethernet. And that means getting the right ESD protection in place to ensure it is both safe and secure while we are driving. ...

The automotive industry’s move to full autonomy, including hand-free autopilot and eventually driverless taxis, will require higher levels of safety scrutiny and sensor accuracy, says Steve Bush, technology editor of Electronics Weekly. Allegro Microsystems is advocating GMR (giant magneto-resistive) -effect sensors, instead of Hall-effect ones, for automotive rotary wheel-position sensing. The company, which makes both Hall-effect and GMR sensors, argues ...

Market penetration of electric vehicles is advancing alongside stricter environmental regulations, core technology innovations and falling costs, says Sam Gold of Renesas. The automotive electrification trend to accelerate the shift towards carbon neutrality has exponentially increased in recent times. Electric vehicles (EVs), which use an electrically powered motor rather than an internal combustion engine (ICE), are referred to as xEVs. ...

Tackling range anxiety and cost hold the key to mass electric vehicle adoption. SiC technology could set the wheels in motion, says Timothé Rossignol of Analog Devices. There are two major disruptions affecting the future of vehicular transport and semiconductor technology: we are embracing new means to propel vehicles cleanly with electrical power, and, simultaneously, re-engineering the semiconductor materials that ...

Adoption of electric vehicles is fuelling an industry in power conversion for a comprehensive charging infrastructure, writes Jon Cooper of Avnet Abacus. Electric vehicles (EVs) are here to stay, with more and more governments mandating a switch to hybrid or fully EVs in the coming years. Automotive manufacturers have had targets imposed on them for average fleet emissions and this ...

The automotive industry stands on the cusp of technological revolution, writes Guido Söhrn of Nexperia. Modern vehicles are becoming more electric and connected, representing a significant shift towards smarter and more sustainable mobility solutions. This unstoppable trend is having a dramatic effect on the way that cars are designed and built. Electronic components and software are expected to make up ...

Smiths Interconnect has created the Intercompact series, a signal + Ethernet PCB connector qualified for demanding rail and industrial applications. The series has PCB-to-PCB and floating mount rack and panel parts, with bodies made from liquid crystal polymer. There are 60 and 41 way signal configurations with ‘Hypertac’ hyperboloid contacts. Described as compact, face-on the connectors are approximately 107 x 15.3mm ...

Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and CSP assemblies does not provide the level of thermal fatigue resistance required by automotive, aerospace, military and semiconductor manufacturers. To ensure that these assembled components are able to withstand long periods of exposure in harsh environments, capillary underfilling using ALPHA ...

NXP has started production of its S32K3 automotive MCU family, built around Arm Cortex-M7 cores, and launched real-time software (called ‘Real-Time Drivers’) alongside it to support S32K3 and all S32 automotive processors featuring Arm Cortex-M or Cortex-R52 cores – so existing S32K1/S32G families too. Intended for body control, S32K3 family includes single, dual and lockstep M7 core configurations supporting ASIL B/D ...

Programmierbare Logik & Systeme (PLS) is covering NXP’s new S32K3 automotive MCU family trace and debug in the latest version of its Universal Debug Engine (UDE). S32K3 MCUs are based on the Arm’s Cortex-M7 core in single, dual and lock-step configurations for ISO 26262 functional safety applications up to ASIL D. Devices are offered in a range of flash memory sizes and ...