We recently had the opportunity to catch up with Lee Harrison, Director of Product Marketing for Siemens EDA, to talk about Streaming Scan Network (SSN) buses and the next-generation of design-for-test technology. In the interview, for example, he discusses the significant changes involved with SSN, de-coupling complexity and dependencies, and delivering test-pattern content in a packetised format. Watch the interview ...
Automotive Electronics
News articles relevant for automotive content, whether in terms of components, power, communications, infotainment or testing.
Secured Wi-Fi 6E and Bluetooth 5.3 radio for vehicles
NXP has announced a dual-band concurrent Wi-Fi and Bluetooth radio for automotive use that includes security. Called AW693, it is a dual Wi-Fi 6/6E and and Bluetooth 5.3 device supporting four modes: CDW 2×2 Wi-Fi 6/6E 5GHz + 1×1 Wi-Fi 6 2.4GHz CDW 1×1 Wi-Fi 6/6E 5GHz + 1×1 Wi-Fi 6 2.4GHz 2×2 Wi-Fi 6 2.4GHz 2×2 Wi-Fi 6/6E 5GHz ...
New package delivers 40V 530μΩ automotive mosfet in 59mm2
Toshiba has launched a 200A 40V 0.66mΩmax automotive grade n-channel mosfet that can handle 600A pulses in a 7 x 8.44 x 2.3mm gull-wing package. “Automotive safety-critical applications such as steering, braking and autonomous driving systems generally require more devices than other systems to meet redundancy requirements. Here, a power mosfet with high current density is required due to the ...
Socionext designing 3nm ADAS SoCs
Socionext is developing 3nm SoCs for ADAS and AD (Autonomous Driving) using TSMC’s N3A process for production in 2026. The SoCs will support ISO26262 functional safety product development, AEC-Q100 and IATF-16949 automotive quality and reliability requirements. Socionext is addressing the performance and safety demands of the rapidly evolving automotive electronic systems required by Automotive OEMs. “We are continuing our history ...
Can inter-vehicle communication improve road safety, and help drones cooperate?
French laboratory CEA-Leti looking to find ways to improve road safety through automated vehicle-to-vehicle communication. Its initiative is intended to “contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection and overall vehicle performance”, according to Leti. By “combining learnings from participation in three EU ...
Dual precision op-amp for automotive sensor signal conditioning
ST has created a dual precision op-amp for automotive sensor signal conditioning, with 20µV input offset voltage and 100nV/°C drift, and operation over 4 to 36V and -40 to 125°C. Input common mode range for TSB182, as it will be known, is from its negative rail to within 2V of its positive rail, and the output is rail-to-rail. Maximum offset ...
NXP reference platform for two-wheelers
NXP has announced a combined digital instrument cluster and connectivity reference platform designed for mass-market two-wheelers, including motorcycles, electric scooters, commuter bikes, and more. The platform combines the high performance i.MX RT1170 crossover MCU with the highly integrated AW611 single-chip Wi-Fi 6 and Bluetooth/Bluetooth Low Energy Audio connectivity solution and the KW45 secure wireless access MCU to deliver a highly ...
Low-capacitance snap-back ESD protection diodes are automotive qualified
Nexperia is aiming at protecting high-speed automotive data lines with ESD protection diodes whose capacitance is as low as 0.28pF. With stand-off voltages in the 18 – 32V range and a snap-back characteristic, the AEC-Q101 (automotive) qualified parts are intended to be used close to connectors on boards. The base part number is PESDxxVF1Byy-Q, with xx representing the nominal stand ...
BOS Semi and Tenstorrent hook up on auto ICs
BOS Semiconductors, the South Korean automotive semiconductor startup, is partnering with AI chip specialist Tenstorrent of Toronto to develop automotive SoCs for automobile application BOS will license Tenstorrent’s AI Tensix core technology to incorporate into BOS Semiconductors’ line of automotive SoCs. Tensix cores are a key element of Tenstorrent’s proprietary AI accelerator chips that are optimized for handling high performance ...
10µF 50V in 1206 aimed at vehicles
Samsung Electro-Mechanics is aiming at automotive powertrains and safety systems with a 10µF 50V MLCC (multi-layer ceramic capacitor) in 3.2 x 1.6mm 1206 packaging. “Thanks to the application of proprietary ceramic and electrode material atomization, alongside ultra-precision lamination, the company was able to create the 10µF MLCC in 1206 size at 50V rating,” according to the company. “Importantly, the new ...