Advanced Packaging expands its footprint

The growing need for AI servers is propelling the advancement of several cutting-edge packaging technologies—including InFO, CoWoS, and SoIC.

Around the world, new facilities are being created:

TSMC is increasing its capacity for advanced packaging in Zhunan, Taichung, Chiayi, and Tainan, among other areas in Taiwan.

Intel is establishing operations in New Mexico, Kulim and Penang.

Samsung, SK hynix, and Micron are launching new HBM packaging facilities in the US, South Korea, Taiwan, and Singapore.

Advanced packaging equipment includes tools such as electroplating machines, die bonders, molting machines, thinning machines, ball placement machines, dicing machines, curing overs, and marking machines.

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