Electronics Weekly Electronics Design & Components Tech News
For those written in the last week, our most popular stories on the site cover Altair buying MDA, atomic clocks, the automotive semiconductor market, the global LiDAR market, Samsung regaining the No.1-spot… Let’s take them in reverse order… 5. Altair to acquire Metrics Design Automation At DAC 2024, Altair showcased its 3D-IC design and SimLab multi-physics modelling and simulation tool. ...
Electro Ramblings
What caught your eye this week? (Efabless, Imec 2nm, 402Tbit/s, ESA)
We're talking democratising chip design, training for Imec's 2nm PDK, 402Tbit/s down standard optical fibre, and ESA's Zero Debris charter...
Most Read – BAE, FD-SOI, Risc-V, AI chip, Auto market
The most popular new stories involve BAE and GlobalFoundries, a European pilot line for 7nm FD-SOI, SiFive's 4th gen RISC-V CPU cores, and indications that the automotive semiconductor market is flagging...
What caught your eye this week? (NoC, AI chip, Radio receiver, Laser comms)
We're talking AI chips, a 300GHz radio receiver front-end, and space terminals in a mesh network to communicate from LEO to GEO...
Most Read – TDK battery, CML GaN, Intel 3nm, SMIC foundry
The most popular stories involve TDK's coin cell battery replacement, a CML Ka-band GaN power amplifier, QuickLogic joining Intel Foundry, Intel 3 in high volume production, and SMIC ranking high in the Top 10 foundries...
What caught your eye this week? (Intel3, foundries, ThrombUS+, VLEO)
We're talking foundry capacity, the Intel3 process, detecting deep vein thrombosis, and Redwire making further inroads into VLEO...
Most Read – Intel fab, Semi sales, Raspberry Pi IPO
For those written this week, the most popular stories involve Sondrel adding an outsourced engineering service, the Raspberry Pi IPO, April chip sales increasing 16%, and Intel delaying Fab 38 in Kiryat Gap, Israel...
What caught your eye this week? (NI, AlN, Raspberry Pi, Sea spaceport)
We're talking test and AI, the Raspberry PI IPO, experimental aluminium nitride substrates, and sea-based spaceports...
Most Read – Intel Irish fab, Arm for Windows, Digital twin
The most popular stories involve an NXP jv for a fab, IBM and Rapidus working on chiplet packaging, Arm ambitions for the Windows PC market, and Intel selling 49% of its Fab 34 in Ireland for $11bn...
What caught your eye this week? (Intel AI, ARM, Wafer bonding)
We're talking thin and light PCs, Arm's Windows PC market share, wafer bonding by CEA-Leti, and lunar night survival technology...
