Electronics Weekly Electronics Design & Components Tech News
‘Companies such as TSMC, Apple, and GlobalFoundries will be able to package and test their essential chips domestically, enabling the full end-to-end cycle of the chip manufacturing process to occur in the United States,’ says the US Department of Commerce (DoC).
“This proposed funding would enhance our supply chain security, create thousands of jobs in Arizona, 
and further position the United States to out-innovate, out-build, and out-compete the rest of the world,” says US Secretary of Commerce Gina Raimondo.
“Amkor is proud to be the leading advanced packaging and test OSAT headquartered in the US, and today’s announcement underscores our commitment to grow America’s domestic semiconductor ecosystem,” says Amkor CEO Giel Rutten.
‘The company’s 2.5D technology is foundational for AI and high-performance computing applications, as it is the final step in the manufacturing of GPUs and other AI chips,’ says the DoC, ‘a lack of 2.5D technology capacity has been a significant chokepoint in the semiconductor industry’s ability to meet the rapidly increasing demand for generative AI products and services.
