ST is to get €2 billion from the Italian government under the auspices of the EU Chips Act to support construction of its $5.4 billion manufacturing site in Catania, Sicily, which will build SiC wafers, fab them in a eight inch facility and package them. “The Catania campus will help reverse the tendency of over-reliance on imports of devices that ...
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Farnell offers own-brand 3D printing filament
Farnell is to stock a range of 3D printing filamants under its Multicomp Pro brand, aiming at “design engineers, creators and hobbyists”, it said. “As interest and demand in 3D printing continues to grow, we are happy to provide our customers with a diversified line-up of 3D printer filaments that are designed to meet the quality standards engineers require,” added ...
Korea announces $19bn semi support fund
Earlier today Korea announced a $19 billion semiconductor support package. Korean president Yoon Suk Yeol (pictured) said that the money was designed to support large-scale investments by Korean chip-makers. The funds will be disbursed by the Korea Development Bank. A fund worth $733 million has been set up to support equipment vendors and fabless companies. Yoon said that the country’s ...
Imec to build beyond-2nm pilot line
Imec will build the NanoIC pilot line – an R&D process line envisioned by the EU Chips Act which will run processes beyond 2nm. Companies will use the NanoIC line to explore new technologies before they are introduced into large-scale production. The NanoIC line It will be constructed as an extension (artist’s impression pictured below) of the already existing imec pilot ...
Rapidus to collaborate with Esperanto on AI ICs
Rapidus, the Japan government-backed startup focussed on 2nm process technology, is to collaborate with RISC-V specialist Esperanto Technologies on developing AI chips. Esperanto develops chip designs for AI/machine learning based on RISC-V. It is headed up by Dave Ditzel (pictured) who was the founder and CEO of the x86 clone startup Transmeta. Rapidus also has a RISC-V-based chip development agreement ...
Nisshinbo adds to Muses
Nisshinbo Micro Devices has added a dual-op amp with a J-FET input stage to to its MUSES sound series targeted at high-end home audio, professional studio equipment, car audio systems, and portable audio devices. The MUSES8920A has noise level of 8.0 nV/√Hz at 1 kHz; total harmonic distortion is 0.0004% at 1 kHz abd a slew rate of 25 V/µs. ...
Polar Semi gets $525m investment
Polar Semiconductor is to get $120 million of US Chips Act money to double its manufacturing capacity for power chips and sensors. The funding will attract total investment of $525 million from private sources, from the company and from the state of Minnesota and other local entities which will transform Polar from a foreign majority owned foundry to a majority ...
Arm revenues up 47%; shares fall
Arm’s calendar Q1 (FY Q4) revenues were up 47% y-o-y at $928 million for a profit of $391 million. Licensing revenue in the fiscal Q4 quarter grew 60% y-o-y to $414 million, royalties grew 37% to $514 million For the full year, revenues were $3,233 million up 21% y-o-y for a profit which was up 80% at $1,408 million, with ...
2023 semi materials market fell 8.2% y-o-y
The semiconductor materials market revenue in 2023 contracted 8.2% to $66.7 billion from the market record of $72.7 billion set in 2022, says Wafer fabrication materials revenue declined 7.0% to $41.5 billion in 2023, while packaging materials revenue fell 10.1% to $25.2 billion last year. The silicon, photoresist ancillaries, wet chemicals, and chemical mechanical planarization (CMP) segments logged the biggest ...
Revenue and profit fall at Infineon
Infineon had calendar Q1 (FY Q2) revenue of €3.632 billion down 2% sequentially and 15% y-o-y for a profit of €707 million down 15% sequentially and 40% y-o-y. Infineon expects 2024 revenue of around €15.1 billion plus or minus €400 million. 2024 capex is set at around €2.8 billion. For calendar Q2, revenue of around €3.8 billion is expected with ...